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1.0mm ENIG Consumer Electronic PCBA Multilayer Assembly Service

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DQS Electronic Co., Limited

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1.0mm ENIG Consumer Electronic PCBA Multilayer Assembly Service

MOQ : 1

Price : Inquiry Us

Payment Terms : T/T

Supply Ability : 200,000+ m² PCB per Month

Layer : 2 L

Min. Component Size : 0402

Board Thickness : 1.0 mm

Surface Finish : ENIG

Pin Space : 0.1mm

Application : Consumer Electronics

Testing Method : Flying Probe, ICT, Functional Test

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China Electronic PCBA Assembly Service

♦ What is Electronic PCBA?

Electronic PCBA (Printed Circuit Board Assembly) is the process of mounting and soldering electronic components onto a fabricated PCB (Printed Circuit Board) to create a functional circuit. Unlike PCB fabrication (which produces the bare board), PCBA involves populating the board with components like resistors, capacitors, ICs, and connectors.

♦ Key Stages of PCBA

1. Solder Paste Application

- A stencil aligns with the PCB, and solder paste (a mix of tiny solder balls and flux) is applied to pads where components will sit.

2. Component Placement (Pick-and-Place)

- Surface Mount Technology (SMT): Automated machines place tiny components (e.g., resistors, ICs) onto the solder paste.
- Through-Hole Technology (THT): Larger components (e.g., connectors, electrolytic capacitors) are inserted into drilled holes.

3. Reflow Soldering (SMT) & Wave Soldering (THT)

- Reflow oven: Heats the PCB, melting the solder paste to form permanent connections.
- Wave soldering: Used for THT parts—the PCB passes over a molten solder wave.

4. Inspection & Testing

- AOI (Automated Optical Inspection): Checks for missing/misaligned components or soldering defects.
- ICT (In-Circuit Testing): Verifies electrical functionality.
- Functional Testing: Ensures the assembled PCB works as intended.

5. Conformal Coating (Optional)

- A protective layer (e.g., silicone, acrylic) may be applied to prevent moisture, dust, or corrosion.

♦ Types of PCBA Services

Type	Description	Best For
Turnkey PCBA	Full service—supplier handles PCB fabrication, component sourcing, assembly, and testing.	Startups, companies wanting hassle-free production.
Consigned PCBA	Customer provides components; assembler only does placement/soldering.	Cost-sensitive projects with existing parts inventory.
Partial Turnkey	Hybrid approach—some parts supplied by customer, others by the assembler.	Customized builds with specialty components.

♦ DQS's PCB Assembly Capability

Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ One-Stop Electronic Manufacturing Including

PCB Prototype	Quick Turn PCB	Single-Sided PCB	Double-Sided PCB	Multilayer PCB	Rigid PCB
Flexible PCB	Rigid-Flex PCB	Rigid-Flex PCB	Aluminum PCB	Metal Core PCB	Thick Copper PCB
HDI PCB	BGA PCB	High TG PCB	PCB Stencil	Impedance Control PCB	PCB Assembly
High-Frequency PCB	Bluetooth Circuit Board	Automotive PCB	USB Circuit Board	Halogen-Free PCB	Antenna PCB

♦ Core Competencies of DQS PCB Assembly

SMT		DIP
13 automatic high-speed SMT line 5 million points / day FPC/Double sided mounted Automatic conformal coating		4 DIP line Post-soldering700,000 points/day Professional DIP plug-in team
	SMT Technology		PCBA OEM
	Min package: 01005 Min pin: 0.3mm Min BGA pitch: 0.3 mm		Full turnkey PCB assembly Partial turnkey PCB assembly

Product Tags:

ENIG Electronic PCBA

1.0mm Electronic PCBA

pcb multilayer Assembly