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High Frequency Signal RF Prototype FR4 Circuit Board PCB 9Ghz For Millimeter Wave Radar

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High Frequency Signal RF Prototype FR4 Circuit Board PCB 9Ghz For Millimeter Wave Radar

MOQ : 1

Price : Send us Gerber file for free quotation

Payment Terms : T/T

Layer : 12 Layer

Material : PTEF/PPO/Rogers

Thickness : 1.0mm

Min. Line Width/Space : 0.1/0.1mm

Copper Thickness : 1.0OZ

Surface treatment : Immersion Gold

Application : Radar

Certificate : UL & IPC Standard & ISO

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9Ghz High Frequency Signal PCB for Millimeter Wave Radar

What's High-Frequency PCB?

High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.

High Frequency Signal RF Prototype FR4 Circuit Board PCB 9Ghz For Millimeter Wave Radar High Frequency Signal RF Prototype FR4 Circuit Board PCB 9Ghz For Millimeter Wave Radar High Frequency Signal RF Prototype FR4 Circuit Board PCB 9Ghz For Millimeter Wave Radar

♦ Features of High-Frequency PCB

    • Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).

    • Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.

    • Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.

    • Strong heat dissipation: metal substrate + thermal simulation + phase change material, adapting to extreme environments from -55℃ to 125℃.

High-frequency PCB Design Principles

    • Impedance control: strictly match the design value (within ±10%).

    • Via design: use less through holes, give priority to blind and buried holes, and complete plating.

    • Shielding protection: key signals are grounded, and metal shielding covers are added when necessary.

    • Thermal management: thermal expansion coefficient matching, and heat dissipation layers are added to key areas.

Technical Parameters

Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

One-Stop PCBs Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production


Product Tags:

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