Low Latency Communications Telecom PCB Assembly for 5G Infrastructure
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
- 5G/4G base stations
- Fiber-optic networking devices
- Satellite communication systems
- Routers, switches, and modems
- RF (Radio Frequency) and microwave systems
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
♦ Features of Telecom PCBs:
1. High-Frequency Materials
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- Use low-loss laminates (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
- Controlled impedance traces to prevent signal reflection.
2. Multilayer & HDI (High-Density Interconnect) Designs
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- 8+ layers for complex routing.
- Microvias & blind/buried vias for compact, high-speed designs.
3. RF & Microwave Components
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- Antennas, amplifiers, filters, and MMICs (Monolithic Microwave ICs).
- Shielding to reduce electromagnetic interference (EMI).
4. Thermal Management
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- Metal-core PCBs (e.g., aluminum), heat sinks, or thermal vias to dissipate heat from high-power components.
5. Strict Compliance Standards
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- IPC-A-600, IPC-6012 (for reliability).
- RoHS, REACH (for environmental safety).
- FCC, CE, ITU-T (for telecom regulations).
♦ Process characteristics of Telecom PCB Assembly
1. Strict component selection
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- Prioritize the use of high-frequency low-loss materials (such as PTFE substrate PCB) and high-temperature resistant chips (working temperature -40℃~125℃);
- RF components must support high-precision impedance control (such as 50Ω matching).
2. High-precision manufacturing requirements:
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- SMT patch accuracy must reach ±0.025mm (±0.05mm for ordinary PCBA) to ensure precise placement of tiny components (such as 01005 package resistors);
- Laser drilling and micro-hole electroplating technology to achieve high-density interconnect (HDI) circuit boards.
♦ Technical Parameters
| PCB Assembly Capability |
| Item | Normal | Special |
| SMT Assembly | PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L＜2mm |
| Maximum | L≤800mm, W≤460mm | L ＞ 1200mm, W＞500mm |
| Thickness( T) | Thinnest | 0.2mm | T＜0.1mm |
| Thickest | 4 mm | T＞4.5mm |
| SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) |
| Max size | 200 * 125 | 200 * 125 |
| component thickness | T≤15mm | 6.5mm＜T≤15mm |
| QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm |
| CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm |
| DIP Assembly | PCB specification | Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L＜50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm |
| Thickness( T) | Thinnest | 0.8mm | T＜0.8mm |
| Thickest | 3.5mm | T＞2mm |
♦ Advantages of DQS Team
- On-time Delivery:
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- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines
2. Quality Guaranteed:
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- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%
3. Premium Service:
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- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production
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Custom Printed SMD Circuit Board PCB Assembly Low Latency For 5G Infrastructure Images
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