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High Density PCB Micro BGA Package Assembly Service Integrated Solution

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DQS Electronic Co., Limited

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High Density PCB Micro BGA Package Assembly Service Integrated Solution

Certification : ISO,UL,IATF16949,RoHs

MOQ : 1

Price : Contact us

Payment Terms : T/T

Base material : FR-4

Copper thickness : 2OZ

Min. line spacing : 3mil

Board thickness : 2.0mm

Min. line width : 0.2mm

Min. hole size : 0.1mm

Surface finishing : Immersion Gold

Application : Consumer Electronics,Industry/Medical/Consumer electronic

Solder mask color : Green Black Red,Blue.green.red.black.white.etc

Pcb test : Flying probe and AOI Test,Flying-Probe PCB test

Pcb assembly method : Mixed,BGA,SMT,Through-hole

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High-Density BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection

♦ What is BGA Assembly?

BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA Assembly is a high-density packaging technology in which the chip is soldered directly to the PCB through an array of "micro solder balls," which is like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.

♦ Features of BGA Assembly?

1. High-Density Interconnections

- - Solder balls are arranged in a grid pattern under the package, allowing for more I/O connections in a smaller area compared to QFP or DIP packages.
  - Ideal for complex ICs like CPUs, GPUs, FPGAs, and memory chips.

2. Improved Electrical & Thermal Performance

- - Shorter electrical paths reduce inductance and improve signal integrity (better for high-speed circuits).
  - Efficient heat dissipation due to direct thermal contact with the PCB (often paired with heatsinks).

3. Space-Efficient & Lightweight

- - Eliminates bulky leads, enabling compact PCB designs (common in smartphones, laptops, and IoT devices).

4. Strong Mechanical Bonding

- - Solder balls provide better shock/vibration resistance than fine-pitch leaded packages (e.g., QFP).

5. Challenges in Assembly & Rework

- - X-ray or AOI (Automated Optical Inspection) required since solder joints are hidden under the chip.
  - Precise reflow soldering needed (temperature control is critical to prevent voids or bridging).

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ One-Stop PCBA Solution


PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA

Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

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High Density PCB Micro BGA Package Assembly Service Integrated Solution