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12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device

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12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device

MOQ : 1

Price : Contact Us

Payment Terms : T/T

Supply Ability : 200,000+ m² PCB per Month

Layer : 12 layers

Material : Fr4

Thickness : 2.0 mm

Construction : 3+N+3

Min. Line Width/Space : 0.1/0.1mm

Surface Treatment : Immersion Gold

Type : Customizable

Application : Medical Device

Standard : UL&IPC Standard &ISO

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12 Layer Blind Hole HDI PCB for Medical Device

♦ What is Blind Hole in PCBs:?

A blind hole (or blind via) is a type of PCB via that connects an outer layer to one or more inner layers but does not go through the entire board (unlike a through-hole via).

Key Characteristics:

✔ Starts from the surface and ends at an internal layer.
✔ Not visible from the opposite side of the PCB.
✔ Used in HDI (High-Density Interconnect) PCBs to save space.
✔ Laser-drilled (typical diameter: 50–150µm).

12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device

♦ Blind Hole vs. Other PCB Vias?

Feature	Blind Hole	Buried Hole	Through-Hole
Visibility	Only on one side	Fully internal	Both sides
Depth	Outer → Inner layer	Inner → Inner layer	Top → Bottom
Manufacturing	Laser-drilled	Mechanically drilled before lamination	Mechanically drilled
Cost	Moderate (HDI PCBs)	High (complex process)	Low (standard PCBs)
Usage	Smartphones, wearables	High-layer-count PCBs	General-purpose PCBs

♦ Why Use Blind Holes?

Space Saving – Allows more routing in compact designs (e.g., smartphones).
Improved Signal Integrity – Reduces stub effects in high-speed circuits.
Higher Layer Utilization – Enables complex multilayer PCBs (e.g., 10+ layers).
Better Thermal Management – Shorter paths reduce heat buildup.

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

Product Tags:

Blind Hole hdi pcb electronics manufacturing

12 Layer hdi pcb electronics manufacturing

HDI fast turn pcb assembly