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ENIG TG180 Communication Flex PCB Assembly Fabrication Service

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ENIG TG180 Communication Flex PCB Assembly Fabrication Service

MOQ : 1

Price : Send us Gerber file for free quotation

Payment Terms : T/T

Layer : 10 Layer

Base Material : TG180

Thickness : 2.0mm

Copper Thickness : 2OZ

Board Size : Customized

Min. Line Width/Space : 0.10/0.10mm

Surface Treatment : ENIG

Certificate : UL,IATF16949,ISO&Reach

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TG180 Communication PCB Manufacturing

What's PCB Manufacturing?

PCB (Printed Circuit Board) manufacturing is the process of designing and producing the physical boards that mechanically support and electrically connect electronic components using conductive pathways, tracks, or signal traces etched from copper sheets laminated onto a non-conductive substrate.

ENIG TG180 Communication Flex PCB Assembly Fabrication Service ENIG TG180 Communication Flex PCB Assembly Fabrication Service ENIG TG180 Communication Flex PCB Assembly Fabrication Service

♦ Key Steps in PCB Manufacturing:​

    1. ​​Design & Layout​​

      • The PCB design is created using software (e.g., Altium Designer, KiCad, Eagle).
      • Schematics are converted into a physical layout with copper traces, pads, and vias.
    2. ​​Printing the Design​​

      • The design is printed onto a film or directly transferred to the board using a photolithographic process.
    3. ​​Substrate Preparation​​

      • The base material (usually FR4 fiberglass) is coated with a thin layer of copper.
    4. ​​Etching​​

      • Unwanted copper is chemically removed, leaving only the desired conductive traces.
    5. ​​Drilling​​

      • Holes are drilled for through-hole components and vias (electrical connections between layers).
    6. ​​Plating & Copper Deposition​​

      • The holes are plated with copper to ensure conductivity between layers.
    7. ​​Solder Mask Application​​

      • A protective layer (usually green) is applied to prevent short circuits and oxidation.
    8. ​​Silkscreen Printing​​

      • Component labels, logos, and identifiers are printed on the board.
    9. ​​Surface Finish​​

      • Exposed copper pads are coated with a finish (e.g., HASL, ENIG, OSP) to prevent corrosion and improve solderability.
    10. ​​Testing & Inspection​​

    • Automated optical inspection (AOI), electrical testing, and functional checks ensure quality.

♦ Types of PCBs:​

    • ​Single-layer PCBs​​ – Simplest, with one conductive layer.
    • ​Double-layer PCBs​​ – Conductors on both sides.
    • ​Multi-layer PCBs​​ – Used in complex electronics (e.g., smartphones, computers).
    • ​Flexible PCBs​​ – Made with bendable materials for wearables and compact devices.
    • ​Rigid-Flex PCBs​​ – Combine rigid and flexible sections.

Technical Parameters

Item

Specification

Laers

1~64

Board thickness

0.1mm-10.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

One-Stop PCBs Solution

ENIG TG180 Communication Flex PCB Assembly Fabrication Service ENIG TG180 Communication Flex PCB Assembly Fabrication Service ENIG TG180 Communication Flex PCB Assembly Fabrication Service ENIG TG180 Communication Flex PCB Assembly Fabrication Service
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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production


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