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8 Layer Automated PCB Manufacturing PCBA Production FR4 TG200 Material

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8 Layer Automated PCB Manufacturing PCBA Production FR4 TG200 Material

Certification : ISO, UL, IPC, Reach

MOQ : 1

Payment Terms : T/T

Supply Ability : Post-soldering 700,000 points/day

Delivery Time : 5-30 days

Layer : 8 Layer

Material : FR4 Tg200

Thickness : 1.5mm

Pin Space : 0.15mm

Min. Component Size : 0201

Min. hole size : 0.1mm

Assembly Process : SMT+DIP

Application : Drilling Equipment

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High Temperature and High Pressure Resistant Industrial PCBA Drilling Equipment PCBA

What Is Industrial Control PCBA?

Industrial control PCBA (Printed Circuit Board Assembly) is a circuit board assembly designed for industrial automation scenarios, which is equivalent to the "brain" of industrial equipment. It integrates processors (such as ARM, DSP), sensor interfaces, communication modules (such as CAN, EtherCAT), actuator drive circuits, etc., to achieve accurate monitoring and control of industrial production processes (such as mechanical movement, temperature control, data acquisition, etc.).

♦ Industrial Control PCBA Process Characteristics

    • Components: Select industrial grade/military grade (temperature resistance -40℃~85℃, voltage resistance 100V+), reject consumer grade.

    • Triple-proof treatment: spray/dip triple-proof paint (moisture-proof/dust-proof/corrosion-proof), pass IP67 test.

    • Thermal design: high-power devices plus heat sink/thermal grease/aluminum substrate to prevent overheating.

    • Manufacturing accuracy: SMT patch ±0.05mm (normal ±0.1mm), DIP plug-in anti-false soldering.

♦ Applications:

    • ​​Manufacturing Automation​​: Automotive welding/assembly robots, electronic SMT placement machines, food packaging equipment, etc., to achieve high-precision production.
    • ​​Robots​​: Industrial robotic arms, AGV carts, collaborative robots, etc., to control movement and interaction.
    • ​​Energy and Power​​: Wind power/photovoltaic inverters, power grid monitoring, energy storage battery management (BMS), etc.
    • ​​Petrochemical/Metallurgy​​: Pumping units, reactor controls, rolling mill equipment, etc., to adapt to high temperature and high pressure environments.

Technical Parameters

PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L<2mm

Maximum

L≤800mm, W≤460mm

L > 1200mm, W>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

T>2mm

One-Stop PCBA Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production


Product Tags:

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