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Laser Radar Power Electronics PCB Assembly High Tg Board Fabrication ODM

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Laser Radar Power Electronics PCB Assembly High Tg Board Fabrication ODM

Certification : ISO, UL, IPC, Reach

MOQ : 1

Payment Terms : T/T

Supply Ability : Post-soldering 700,000 points/day

Delivery Time : 5-30 days

Layer : 10 Layer

Material : FR4 Tg180

Thickness : 2.0mm±10%

Pin Space : 0.2mm

Min. Component Size : 01005

Assembly Process : SMT+DIP

PCBA Test : X-ray,AOI Test,Functional test

Application : LiDAR

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Laser Radar PCBA Industrial PCBA High Precision Signal Processing High Tg Board

♦ What Is Industrial Control PCBA?

Industrial Control PCBA is a specialized printed circuit board assembly designed for industrial control applications. It is used to build critical components such as control panels, programmable logic controllers (PLCs), and motor drives in industrial systems.

♦ Features of Industrial-grade Laser Radar PCBA

High precision: fine line layout to ensure accurate detection.
High speed: support fast scanning, real-time generation of three-dimensional data.
Strong reliability: anti-interference design, 7×24 hours stable operation.
Multi-layer board: optimize wiring, reduce signal interference.
Anti-electromagnetic interference: multiple filtering protection, passed EMC certification.

♦ Applications:

Manufacturing Automation: Automotive welding/assembly robots, electronic SMT placement machines, food packaging equipment, etc., to achieve high-precision production.
Robots: Industrial robotic arms, AGV carts, collaborative robots, etc., to control movement and interaction.
Energy and Power: Wind power/photovoltaic inverters, power grid monitoring, energy storage battery management (BMS), etc.
Petrochemical/Metallurgy: Pumping units, reactor controls, rolling mill equipment, etc., to adapt to high temperature and high pressure environments.

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ One-Stop PCBA Solution


PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA

Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

Product Tags:

power electronics pcb fabrication

High Tg power electronics pcb

ODM electronics pcb assembly

China Laser Radar Power Electronics PCB Assembly High Tg Board Fabrication ODM wholesale

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