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Certification : ISO, UL, IPC, Reach
MOQ : 1
Payment Terms : T/T
Supply Ability : Post-soldering 700,000 points/day
Delivery Time : 5-30 days
Layer : 18
Material : FR4
Thickness : 2.0mm
Pin Space : 0.15mm
Min. Component Size : 0201
Min. hole size : 0.1mm
Assembly Process : SMT+DIP
Application : Power Grid Monitoring Equipment
PCBA Service : Turnkey Assembly PCBA Service
Multifunctional Integrated Industrial PCBA Fast Response for Power Grid Monitoring Equipment
♦ What Is Industrial Control PCBA?
Industrial control PCBA (Printed Circuit Board Assembly) is a circuit board assembly designed for industrial automation scenarios, which is equivalent to the "brain" of industrial equipment. It integrates processors (such as ARM, DSP), sensor interfaces, communication modules (such as CAN, EtherCAT), actuator drive circuits, etc., to achieve accurate monitoring and control of industrial production processes (such as mechanical movement, temperature control, data acquisition, etc.).
♦ Industrial Control PCBA Features
High reliability: resistant to high temperature (metallurgy), high humidity (chemical industry), strong interference (motor), MTBF>100,000 hours.
Strong anti-interference: metal shielding, three-proof treatment (waterproof/dustproof/corrosion-proof), optimized wiring, to ensure signal stability.
Functional integration: integrated data acquisition, control, communication and other functions, support multi-device linkage (such as motor + sensor + cloud).
Long life: industrial-grade components (chips/capacitors), suitable for 5-10 years of long-term operation, reducing the need for replacement.
♦ Applications:
♦ Technical Parameters
PCB Assembly Capability | |||||
Item |
Normal |
Special | |||
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm |
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Integrated SMT DIP Industrial PCBA Assembly For Electronics 2.0mm Images |